The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2008
Filed:
Dec. 30, 2005
Wei Fan, Middleburg Heights, OH (US);
Ajit Sane, Medina, OH (US);
Jeffrey Lennartz, Cleveland, OH (US);
Tae Won Kim, Medina, OH (US);
Wei Fan, Middleburg Heights, OH (US);
Ajit Sane, Medina, OH (US);
Jeffrey Lennartz, Cleveland, OH (US);
Tae Won Kim, Medina, OH (US);
Momentive Performance Materials Inc., Albany, NY (US);
Abstract
A wafer processing apparatus is fabricated by depositing a film electrode onto the surface of a base substrate, the structure is then overcoated with a protective coating film layer comprising at least one of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and combinations thereof. The film electrode has a coefficient of thermal expansion (CTE) that closely matches the CTE of the underlying base substrate layer as well as the CTE of the protective coating layer.