The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2008
Filed:
Oct. 29, 2002
Makoto Iwai, Chiba Prefecture, JP;
Keiji Wakita, Chiba Prefecture, JP;
Akihiko Shirahata, Chiba Prefecture, JP;
Makoto Iwai, Chiba Prefecture, JP;
Keiji Wakita, Chiba Prefecture, JP;
Akihiko Shirahata, Chiba Prefecture, JP;
Dow Corning Toray Silicone Co., Ltd., Tokyo, JP;
Abstract
A curable organic resin composition comprising (A) 100 parts by weight of a curable organic resin and (B) 0.01 to 100 parts by weight of a thiocyanato-containing organohydrocarbonoxysilane or an isothiocyanato-containing organohydrocarbonoxysilane represented by the general formula: X—R—Si(OR)nR, wherein X is NCS— or SCN—, Ris an alkylene or alkyleneoxyalkylene group, Rand Rare monovalent hydrocarbon groups, and the subscript n is 1, 2, or 3. The curable organic resin composition possesses superior moldability and, when cured, exhibits superior adhesive properties on substrates such as metals.