The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2008
Filed:
Jul. 29, 2005
Norio Takahashi, Hiratsuka, JP;
Wataru Kiyosawa, Hiratsuka, JP;
Norio Takahashi, Hiratsuka, JP;
Wataru Kiyosawa, Hiratsuka, JP;
Komatsu Electronics Inc., Kanagawa, JP;
Abstract
Resins () are interposed as insulating layers between heat radiation side and heat absorption side heat exchange bodies () and heat radiation side and heat absorption side electrodes () of a thermoelectric conversion element module (). The resin () is fusion bonded to the heat radiation side heat exchange body (), and the resin () is fusion bonded to the heat radiation side heat exchange body (). The material of the resins () is, for example, a thermosetting plastic. The thermosetting plastic becomes soft when heated and then cures. At the time of fusion bonding of the resins () to the heat exchange bodies (), the heat exchange bodies () and the resins () are heated and pressed. Then, the resins () become soft and enter the cavities and flaws formed in the surfaces of the heat exchange bodies (). The resins () having entered the cavities and flaws cure to fill the cavities in the surfaces of the heat exchange bodies ().