The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7444058 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 28, 2008

Filed:

Mar. 05, 2007
Applicants:

Toshihisa Nonaka, Otsu, JP;

Noboru Asahi, Otsu, JP;

Yoshiko Tatsuta, Otsu, JP;

Inventors:

Toshihisa Nonaka, Otsu, JP;

Noboru Asahi, Otsu, JP;

Yoshiko Tatsuta, Otsu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

This invention is a resin composition for optical wiring, comprising an inorganic filler with an average particle size of 1 nm to 100 nm and a resin, having a ratio n/n(where nis the refractive index of the inorganic filler and nis the refractive index of the resin) of 0.8 to 1.2, a thermal expansion coefficient of −1×10/° C. to 4×10/° C., and a true dependency value of its refractive index on the temperature of −1×10/° C. to 1×10/° C. in a temperature range from −20° C. to 90° C., and substantially incapable of absorbing light in a wavelength range from 0.6 to 0.9 μm or from 1.2 to 1.6 μm. This invention also provides an optoelectronic circuit board.


Find Patent Forward Citations

Nonaka, Toshihisa. (2008). Resin composition for optical wiring, and optoelectronic circuit board (U.S. Patent No. 7444058). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7444058

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