The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2008
Filed:
Dec. 11, 2003
Noriaki Sakamoto, Gunma, JP;
Noriaki Sakamoto, Gunma, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Kanto Sanyo Semiconductors Co., Ltd., Gunma, JP;
Abstract
A circuit devicecomprises a die pad, bonding pads, a circuit element, affixed onto die pad, and an insulating resin, which seals die pad, bonding pads, and circuit element, and has a configuration wherein recessed partsare formed at parts of the side surfaces of insulating resin, and side surface of the conductive patterns that are disposed at peripheral parts are exposed from recessed parts. By bonding pads, which are to become connecting electrodes to the exterior, being exposed at the side surfaces, fillets of a brazing materialare formed at the sides of the device when circuit deviceis mounted.