The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2008
Filed:
Jun. 06, 2006
Charles C. Haluzak, Corvallis, OR (US);
Martha A. Truninger, Corvallis, OR (US);
Donald L. Michael, Monmouth, OR (US);
Charles C. Haluzak, Corvallis, OR (US);
Martha A. Truninger, Corvallis, OR (US);
Donald L. Michael, Monmouth, OR (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second substrate wafers and the underbump define a chamber that contains at least one microelectronic device.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile