The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2008
Filed:
Apr. 25, 2006
Akiko Okubo, Kanagawa, JP;
Yoshiyuki Goh, Kanagawa, JP;
Yoshihito Akiyama, Kanagawa, JP;
Hiroshi Hirose, Kanagawa, JP;
Hirotaka Nonaka, Kanagawa, JP;
Maki Sugawara, Kanagawa, JP;
Akiko Okubo, Kanagawa, JP;
Yoshiyuki Goh, Kanagawa, JP;
Yoshihito Akiyama, Kanagawa, JP;
Hiroshi Hirose, Kanagawa, JP;
Hirotaka Nonaka, Kanagawa, JP;
Maki Sugawara, Kanagawa, JP;
Sumitomo Baeklite Company Limited, Tokyo, JP;
Abstract
A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).