The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7442624 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 28, 2008

Filed:

Aug. 02, 2004
Applicants:

Chandrasekhar Sarma, Poughkeepsie, NY (US);

Ihar Kasko, Mennecy, FR;

Inventors:

Chandrasekhar Sarma, Poughkeepsie, NY (US);

Ihar Kasko, Mennecy, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/46 (2006.01); H01L 21/78 (2006.01); H01L 21/301 (2006.01); H01L 21/76 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of forming alignment marks on edge chips in a kerf region of a semiconductor workpiece. The alignment marks are formed in at least one material layer of the semiconductor device. The alignment marks are formed using a separate lithography mask, and may extend into lower layers, including the workpiece, of the semiconductor device. An opaque material layer is deposited, and depressions are formed in the opaque layer over the deep alignment mark trenches. The depressions in the opaque material layer are used to align a lithography process to open the opaque material layer over alignment marks in an underlying metallization layer. The alignment marks in the metallization layer are then used to align the lithography process used to pattern the opaque material layer.


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