The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2008
Filed:
Jun. 28, 2006
Masahiro Onishi, HongKong, CN;
Heng Wang, HongKong, CN;
Masahiro Onishi, HongKong, CN;
Heng Wang, HongKong, CN;
SAE Magnetics (H.K.) Ltd., Hong Kong, CN;
Abstract
The invention relates to an optical module manufacturing method for bonding a can portion having an optical semiconductor element and a barrel portion of the optical module together, comprising the steps of: a bonding step for bonding a joint surface of the can portion and a joint surface of the barrel portion by thermoset adhesive, so as to form an interior room defined by the bonded can portion and barrel portion (S); a receiving step for receiving the bonded can portion and the barrel portion into a hermetical container (S); a curing step for heating interior of the hermetical container so as to solidify the thermoset adhesive dispensed on the joint surfaces (S); a cooling step for reducing a temperature inside the hermetical container after the thermoset adhesive is cured (S); and a step of taking the can portion and the barrel portion out from the hermetical container. The resin on the joint portion of the can portion and the barrel portion can be cured at a high temperature under condition that the can portion and the barrel portion are sealed together.