The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2008
Filed:
Oct. 17, 2006
Kenji Takano, Kawasaki, JP;
Munekazu Shibata, Kawasaki, JP;
Kazuya Arai, Kawasaki, JP;
Junichi Kanai, Kawasaki, JP;
Kaoru Sugimoto, Kawasaki, JP;
Kenji Takano, Kawasaki, JP;
Munekazu Shibata, Kawasaki, JP;
Kazuya Arai, Kawasaki, JP;
Junichi Kanai, Kawasaki, JP;
Kaoru Sugimoto, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A process for producing a circuit board includes the steps of etching the third metal layer of a three-layer metal laminate into a predetermined interconnection pattern by photolithography; forming a laminate on the interconnection pattern by a buildup method, the laminate including interconnection patterns with insulating layers provided therebetween, the interconnection patterns being electrically connected to each other; separating a first metal layer from a supporting substrate to detach the laminate; removing the first metal layer of the three-layer metal laminate by etching using a second metal layer as a barrier layer; and removing the exposed second metal layer by etching.