The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2008
Filed:
Oct. 06, 2004
Charles E. Baumgartner, Niskayuna, NY (US);
David M. Mills, Niskayuna, NY (US);
Robert S. Lewandowski, Amsterdam, NY (US);
Lowell Scott Smith, Niskayuna, NY (US);
Douglas G. Wildes, Ballston Lake, NY (US);
Charles E. Baumgartner, Niskayuna, NY (US);
David M. Mills, Niskayuna, NY (US);
Robert S. Lewandowski, Amsterdam, NY (US);
Lowell Scott Smith, Niskayuna, NY (US);
Douglas G. Wildes, Ballston Lake, NY (US);
General Electric Company, Niskayuna, NY (US);
Abstract
An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface. The backing material may also possess a high thermal conductivity to assist in removal of heat from the device.