The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2008
Filed:
Feb. 01, 2006
Sean Ashley Bailey, San Francisco, CA (US);
Richard Lidio Blanco, Jr., Santa Clara, CA (US);
David Edwards, Poughkeepsie, NY (US);
Supratik Guha, Chappaqua, NY (US);
Michael David Hillman, Los Altos, CA (US);
Yves C. Martin, Ossining, NY (US);
Phillip Lee Mort, Santa Clara, CA (US);
Roger Schmidt, Poughkeepsie, NY (US);
Prabjit Singh, Poughkeepsie, NY (US);
Ronald Jack Smith, Foster City, CA (US);
Gregory L. Tice, Los Altos, CA (US);
Theodore Gerard Van Kessel, Millbrook, NY (US);
Sean Ashley Bailey, San Francisco, CA (US);
Richard Lidio Blanco, Jr., Santa Clara, CA (US);
David Edwards, Poughkeepsie, NY (US);
Supratik Guha, Chappaqua, NY (US);
Michael David Hillman, Los Altos, CA (US);
Yves C. Martin, Ossining, NY (US);
Phillip Lee Mort, Santa Clara, CA (US);
Roger Schmidt, Poughkeepsie, NY (US);
Prabjit Singh, Poughkeepsie, NY (US);
Ronald Jack Smith, Foster City, CA (US);
Gregory L. Tice, Los Altos, CA (US);
Theodore Gerard van Kessel, Millbrook, NY (US);
Apple Inc., Cupertino, CA (US);
Abstract
An apparatus for conducting heat from a computer component to a heat sink. The invention may include a thermal interface material (TIM). The invention may further include a seal or gasket that at least partially encloses the TIM. The gasket may facilitate retaining the TIM within its sidewall, and thus in place on or near a computer component. Generally, the gasket may be placed between the computer component (or a silicon board or other material upon which the computer component is located) and a heat sink. An insert may be placed within the gasket and define an aperture. The chip seats in the aperture and thus is spatially located with respect to the insert. The TIM abuts both the computer component and a heat sink. A desiccant may be located within the gasket and absorb any moisture diffusing or migrating through the gasket.