The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2008
Filed:
Apr. 09, 2003
Dev E. Kumar, San Jose, CA (US);
Giorgio Giaretta, Mountain View, CA (US);
Stefano Schiaffino, Menlo Park, CA (US);
Donald A. Ice, Milpitas, CA (US);
Dev E. Kumar, San Jose, CA (US);
Giorgio Giaretta, Mountain View, CA (US);
Stefano Schiaffino, Menlo Park, CA (US);
Donald A. Ice, Milpitas, CA (US);
Finisar Corporation, Sunnyvale, CA (US);
Abstract
Flexible printed circuit boards interconnect to adjacent electronic devices through one or more of high speed data, low speed data, high current, and ground lines and pads. The design of the high speed data pads and traces and adjacent ground pads and traces maintains a desired impedance in the flexible circuit and at the transition from the flexible circuit to a printed circuit board, a ceramic header, or other device to ensure high speed operation. The pads are preferably arranged in a two dimensional geometry such that a connecting area of the flexible circuit is narrower than it would preferably be if the pads were arranged linearly. The two dimensional array also allows the use of the high current thermoelectric cooler pads, which require large surface areas that may otherwise not fit in a conventional linear array.