The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2008
Filed:
Jul. 06, 2006
Tetsuji Tokiwa, Tokyo, JP;
Tomohiro Kondo, Tokyo, JP;
Tetsuji Tokiwa, Tokyo, JP;
Tomohiro Kondo, Tokyo, JP;
Asahi Kasei Chemicals Corporation, Tokyo, JP;
Abstract
The present invention can provide a resin composition comprising epoxy-modified polyphenylene ethers which show good solubility in MEK or acetone which has been conventionally used in a manufacturing process for printed boards of epoxy resins, and has high heat resistance originating from polyphenylene ethers. Specifically, the resin composition of the present invention contains (C) an epoxy-modified polyphenylene ether obtained by reacting (A) a polyphenylene ether having a content of volatile components of 0.1-5.0% by weight and a number of average molecular weight of 500 or more and less than 1.0×10and (B) a cresol-novolac type epoxy resin at a modification ratio of component (A) of 5-95%, wherein (B') a cresol-novolac type epoxy resin is contained in an amount of 10-900 parts by weight based on 100 parts by weight of the total of the reaction products (C), and (A′) a polyphenylene ether.