The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2008
Filed:
Feb. 17, 2006
Hung-sheng HU, Kaohsiung, TW;
Wei-lin Chen, Taipei, TW;
Tsung-ping Hsu, Taoyuan, TW;
Der-rong Shyn, Chiayi County, TW;
Hung-Sheng Hu, Kaohsiung, TW;
Wei-Lin Chen, Taipei, TW;
Tsung-Ping Hsu, Taoyuan, TW;
Der-Rong Shyn, Chiayi County, TW;
Qisda Corporation, Taoyuan, TW;
Benq Corporation, Taipei, TW;
Abstract
Methods for fabricating fluid injection devices. A patterned sacrificial layer is formed on a substrate. A patterned first structural layer is formed on the substrate covering the sacrificial layer. At least one fluid actuator is formed on the structural layer. A first passivation layer is formed on the first structural covering the at least one fluid actuator. An under bump metal (UBM) layer is conformably formed on the first passivation layer. A patterned first photoresist is formed at a predetermined nozzle site and a contact opening site exposes the UBM layer. A second structural layer is formed on the UBM layer. An etching protective layer is formed on the second structural layer. The first photoresist is removed creating an opening at the nozzle site exposing the UBM layer. The UBM layer in the opening is removed.