The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2008

Filed:

Oct. 24, 2003
Applicants:

Takahisa Miyawaki, Sodegaura, JP;

Kenichi Yashiro, Sodegaura, JP;

Kei Nagata, Sodegaura, JP;

Inventors:

Takahisa Miyawaki, Sodegaura, JP;

Kenichi Yashiro, Sodegaura, JP;

Kei Nagata, Sodegaura, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 19/54 (2006.01); G02F 1/1339 (2006.01); C08G 59/14 (2006.01); C08L 63/10 (2006.01); C08L 83/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides a liquid crystal sealing composition and a liquid crystal display panel excellent in adhesion, moisture permeation resistance and heat resistance and superior for use in a sheet press heating bonding system. The liquid crystal sealing composition comprises (1) an alkoxysilyl group-containing modified epoxy resin obtained by de-alcohol condensation reaction of (a) an epoxy resin having at least one hydroxyl group in one molecule and (b) an alkoxysilyl group-containing compound, (2) a heat latent epoxy curing agent, (3) a filler having an average particle diameter of 0.1 to 10 μm, and if necessary (4) an epoxy resin having at least 1.2 epoxy groups on average in one molecule, (5) an aprotic solvent having a boiling point in the range of 140 to 220° C., compatible with epoxy resin and inert to an epoxy group, and (6) other additives.


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