The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 21, 2008

Filed:

May. 12, 2006
Applicant:

Myoungsoo Jeon, Fremont, CA (US);

Inventor:

Myoungsoo Jeon, Fremont, CA (US);

Assignee:

Other;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 4/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A high speed socket includes an insulative housing and a printed circuit board body portion. The PCB body portion includes a PCB and surface mount contacts. Each surface mount contact has a first end portion for making contact with an integrated circuit held in the socket and a second end portion for surface mounting to a printed circuit board. The socket's printed circuit board includes AC grounded conductive columns (ACGCC) that extend from a first planar surface of the PCB to a second planar surface of the PCB. The printed circuit board also includes signal conductors. The signal conductors are shielded by the ACGCCs. In one aspect, the socket includes capacitors that are surface mounted to the socket's PCB. In another aspect, the surface mount contacts include self-adjusting solder tails that accommodate PCB warpage.


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