The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2008

Filed:

Nov. 30, 2006
Applicants:

Feng-ku Wang, Taipei, TW;

Yi-lun Cheng, Taipei, TW;

Jui-chan Fan, Taipei, TW;

Chun-yi Chang, Taipei, TW;

Chun-lung Lin, Taipei, TW;

Chih-kai Yang, Taipei, TW;

Inventors:

Feng-Ku Wang, Taipei, TW;

Yi-Lun Cheng, Taipei, TW;

Jui-Chan Fan, Taipei, TW;

Chun-Yi Chang, Taipei, TW;

Chun-Lung Lin, Taipei, TW;

Chih-Kai Yang, Taipei, TW;

Assignee:

Inventec Corporation, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 7/00 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A fixing structure of heat conduction pad is used to uniformly press two heat conduction pads on the two heat generating electronic components on a circuit board respectively. The fixing structure includes a fixing member and an elastic member. The two ends of the elastic member are a fastening portion and a fixing portion respectively. The middle part of the elastic member is a pressing portion. In addition, a suspension arm is extended from the fixing portion. When the fastening portion is to be fasten on the circuit board and the fixing portion is to be fixed on the circuit board by the fixing member, the pressing portion presses one of the heat conduction pad on one of the heat generating electronic component, and the suspension arm presses the other heat conduction pad on the other heat generating electronic component.


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