The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2008
Filed:
Oct. 31, 2007
Yoshihiro Omura, Shimane-ken, JP;
Yoshihiro Omura, Shimane-ken, JP;
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Abstract
The heat resistance of a joint between a terminal electrode and a metal terminal as well as the bonding strength of the joint are increased in a ceramic electronic component. The surface of the metal terminal in contact with a binder is formed of a coating layer which is a Ag-based metal plated film. The binder contains a metal powder composed of a Cu-based metal and having an average particle diameter of 2.0 μm or less and a glass component. The step of joining the metal terminal to a terminal electrode via the binder includes bringing the terminal electrode into intimate contact with the metal terminal via the binder and heat-treating them at a temperature in the range of 550° C. to 750° C. to form a Ag—Cu alloy layer between the metal terminal and a metal bonding layer, thus joining the terminal electrode to the metal terminal by Ag—Cu alloy bonding.