The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 14, 2008

Filed:

Feb. 26, 2003
Applicants:

Ken Hirunuma, Tokyo, JP;

Keiichi Hotta, Tokyo, JP;

Gouji Funatsu, Saitama, JP;

Inventors:

Ken Hirunuma, Tokyo, JP;

Keiichi Hotta, Tokyo, JP;

Gouji Funatsu, Saitama, JP;

Assignee:

Hoya Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 3/14 (2006.01); H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
Abstract

A mounting plate has an opening provided for bonding a solid-state imaging device thereto. The opening of the mounting plate comprises a first edge portion and a second edge portion. The first edge portion corresponds to a first side of part of the contour of a light receiving area of the solid-state imaging device. The second edge portion corresponds to a second side of part of the contour. The first and second edge portions function as reference lines for positioning the solid-state imaging device over said opening.


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