The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2008
Filed:
Oct. 22, 2007
Woo-seop Kim, Seoul, KR;
Woo-Seop Kim, Seoul, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A stack-type semiconductor package socket may include: a first package connection portion for connection with leads of a lowermost package of a stack-type semiconductor package; a second package connection portion for connection between pads of an odd-numbered package and leads of an even-numbered package, wherein the odd-numbered package and the even-numbered package are adjacent to each other; a lower case for fixing the first package connection portion; and an upper case for fixing the second package connection portion. A stack-type semiconductor package test system may include: a stack-type semiconductor package socket that includes first and second package connection portions; a printed circuit board electrically connected to leads of the lowermost package through the first package connection portion; and a test controller for receiving, outputting, or receiving and outputting signals from, to, or from and to the stack-type semiconductor package through the PCB and the stack-type semiconductor package socket.