The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2008
Filed:
Jun. 09, 2004
Pradip Patel, Redwood City, CA (US);
Maurice O. Othieno, Union City, CA (US);
Manickam Thavarajah, San Jose, CA (US);
Severino A. Legaspi, Jr., Santa Clara, CA (US);
Pradip Patel, Redwood City, CA (US);
Maurice O. Othieno, Union City, CA (US);
Manickam Thavarajah, San Jose, CA (US);
Severino A. Legaspi, Jr., Santa Clara, CA (US);
LSI Corporation, Milpitas, CA (US);
Abstract
A semiconductor integrated circuit package incorporating a preformed one-piece mold cap and heatspreader assembly is disclosed. One implementation includes a substrate with a die attached to the substrate. The die is electrically connected with electrical connections formed on the substrate using bonding wires. A preformed one-piece integrated mold cap and heatspreader assembly attached to the substrate to enclose at least a portion of the bonding wires and the die. Methods of assembling semiconductor integrated circuit packages using a preformed one-piece integrated mold cap and heatspreader assembly are also disclosed.