The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2008
Filed:
Feb. 02, 2005
Han-shin Youn, Cheonan-si, KR;
Hyun-ki Kim, Cheonan-si, KR;
Han-Shin Youn, Cheonan-si, KR;
Hyun-Ki Kim, Cheonan-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor chip package with a lead frame having a plurality of leads formed along four sides of the lead frame and tie bars extending from an edge of each of the four sides, wherein bottom surfaces of the tie bars are recessed, a semiconductor chip which is adhered to the recessed surfaces of the tie bars, connectors which electrically connect a plurality of chip pads formed on an upper surface of the semiconductor chip with the plurality of leads, and an encapsulant which encapsulates the upper surface of the semiconductor chip, the connector and bonding portions of the connector.