The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2008
Filed:
May. 19, 2006
Hirochika Narita, Kanagawa, JP;
Ryuya Kuroda, Kanagawa, JP;
Hirochika Narita, Kanagawa, JP;
Ryuya Kuroda, Kanagawa, JP;
NEC Electronics Corporation, Kanagawa, JP;
Abstract
To provide a solid-state image sensing device that is capable of improving the connection reliability of bonding pads and bonding wires. A solid-state image sensing elementof the present invention contains a long plate-shaped metal substrate, a long plate-shaped solid-state image sensing elementfixed to the surface of the metal substratevia an adhesive layer, and bonding pads, formed on the surface of the solid-state image sensing element, for electrically connecting to the lead frame via bonding wires. The adhesive layercontains a first adhesive layer, and a second adhesive layerof a higher modulus of elasticity than the first adhesive layer, and at the regions directly below the bonding padsprovided at both end sections in a longitudinal direction of the solid-state image sensing element, the metal substrateand the solid-state image sensing elementare fixed via the second adhesive layer