The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2008
Filed:
Mar. 19, 2004
Kazuhiko Oda, Tokyo, JP;
Tetsuji Maruno, Tokyo, JP;
Akira Sasaki, Tokyo, JP;
Kouji Tanaka, Tokyo, JP;
Kazuhiko Oda, Tokyo, JP;
Tetsuji Maruno, Tokyo, JP;
Akira Sasaki, Tokyo, JP;
Kouji Tanaka, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A manufacturing method of conductive paste comprising arranging process (Sto S) of ceramics particles, arranging process (Sto S) of wetted metal particles, forming process (S) of slurry wherein metal particles and ceramics particles are mixed and dispersion treatment process (S) by applying collision to the slurry. The arranging process of wetted metal particles comprises, a process (S) of adding solvent, compatible with organic component in conductive paste and incompatible with water, to undried water washed metal particles, a process (S) of adding surfactant, a process (S) of separating water from the metal particles and a process (S) of adding acetone or the other second solvent.