The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2008
Filed:
Aug. 18, 2005
John C. Monsees, El Cajon, CA (US);
Donald O. Nelepovitz, La Jolla, CA (US);
John C. Monsees, El Cajon, CA (US);
Donald O. Nelepovitz, La Jolla, CA (US);
Hi-Tech Welding and Forming, Inc., El Cajon, CA (US);
Abstract
A bi-material die apparatus for high temperature forming of metal parts has at least two opposing die segments having inner surfaces together forming a hollow mold chamber for receiving a mold blank between the die segments. The die segments are of a first material having a first coefficient of thermal expansion CTE. At least one insert of a second material is associated with the inner surface of at least one of the die segments so as to project into the mold chamber, the second material having a second coefficient of thermal expansion CTEhigher than CTEand higher than the coefficient of thermal expansion of the metal product to be formed in the cavity.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile