The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2008
Filed:
Jan. 13, 2005
Satya Prakash Arya, San Jose, CA (US);
Xinzhi Xing, San Jose, CA (US);
Satya Prakash Arya, San Jose, CA (US);
Xinzhi Xing, San Jose, CA (US);
Hitachi Global Storage Technologies Netherlands B.V., Amsterdam, NL;
Abstract
An apparatus and method for reducing solder pad size in an electrical lead suspension (ELS) to decrease signal path capacitive discontinuities. The method provides a base-metal layer for the ELS. A dielectric layer above the base-metal layer is also provided. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein both a size of the solder pad portion and an amount of solder applied to the solder pad portion are reduced such that the solder pad to a ground, and solder on the solder pad to adjacent solder on adjacent pads, capacitance are reduced providing low signal reflection losses and a decrease in cross-talk.