The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2008
Filed:
Feb. 28, 2008
Yasuharu Yamada, Shiga, JP;
Tsutomu Nakae, Shiga, JP;
Yasuharu Yamada, Shiga, JP;
Tsutomu Nakae, Shiga, JP;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A thermal enhanced structure comprising a packaged electronic device and a heat sink that is removably attached thereto. The thermal enhanced structure includes a plastic ball grid array (PGBA) with an electronic chip, a plastic mold cover, and a heat spreader with a plurality of spaced apart securing studs positioned and caulked at a periphery edge thereof. The mold cover, the heat spreader and studs are molded and embedded with one another to form a single unit with improved torque strength and heat dissipation. The single molded unit and the plastic ball grid array are secured together by an adhesive material. Then the heat sink can be easily and removably attached to the molded single unit by fastening elements to the molded studs, thereby allowing more efficient controllable forces or pressures to be applied as the mechanical fastening elements are removably attached to the molded studs to thereby prevent stress and damage to the PBGA package.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile