The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2008
Filed:
Apr. 17, 2007
Saiki Yamamoto, Tokushima, JP;
Ikuya Nii, Anan-shi, JP;
Hiroaki Ukawa, Tokushima, JP;
Nichia Corporation, Anan-shi, Tokushima, JP;
Abstract
The present invention provides a semiconductor device capable of preventing an adhesive for die bonding from flowing to wire bonding area. The semiconductor device of the present invention comprises a semiconductor elementhaving a pair of electrodes, a housinghaving the recessfor accommodating the semiconductor element, a first lead electrodeand the second lead electrodewhich are exposed on the bottom of the recess, an adhesive layerfor die bonding between the semiconductor elementand the first lead electrode, and electrically conductive wiresfor wire bonding between one electrode of the pair of electrodes of the semiconductor element and the first lead electrodeand between the other electrode and the second lead electrode, wherein the housinghas the wallformed to extend across the bottom surface of the recessso as to divide the surface of the first lead electrodeinto a die bonding areaand a wire bonding area, and the first lead electrodehas the notchwhich is formed by cutting off a portion of an edge of the first lead electrodeand located at least just below the wall, while the walland the bottom portionof the housingare connected to each other through the notch