The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2008
Filed:
Sep. 06, 2006
Kazuo Teshirogi, Kawasaki, JP;
Yuzo Shimobeppu, Kawasaki, JP;
Kazuhiro Yoshimoto, Kawasaki, JP;
Yoshiaki Shinjo, Kawasaki, JP;
Masataka Mizukoshi, Kawasaki, JP;
Kazuo Teshirogi, Kawasaki, JP;
Yuzo Shimobeppu, Kawasaki, JP;
Kazuhiro Yoshimoto, Kawasaki, JP;
Yoshiaki Shinjo, Kawasaki, JP;
Masataka Mizukoshi, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
To provide a low-cost, efficient semiconductor device manufacturing method for connecting electrodes of a pair of bases (e.g., a pair of a semiconductor chip and a circuit board, or a pair of semiconductor chips) together in a short time. The method of the present invention includes: forming magnetic bumpson at least one of first and second basesA andto be bonded together at their corresponding electrodes (e.g., electrodesand electrodes); aligning the electrodesof the first baseA to positions corresponding to the electrodesof the second basefor connection, by means of magnetic forces of the magnetic bumpsformed over the first baseA; and connecting the electrodesof the first baseA to the electrodesof the second base, wherein the alignment is made for a plurality of the first basesA at a time.