The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7431816 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 07, 2008

Filed:

Jun. 01, 2004
Applicants:

Ryuichiro Maeyama, Ashigarakami-gun, JP;

Kazuyoshi Itoh, Ashigarakami-gun, JP;

Yasutaka Naito, Ashigarakami-gun, JP;

Hideaki Ohara, Ashigarakami-gun, JP;

Inventors:

Ryuichiro Maeyama, Ashigarakami-gun, JP;

Kazuyoshi Itoh, Ashigarakami-gun, JP;

Yasutaka Naito, Ashigarakami-gun, JP;

Hideaki Ohara, Ashigarakami-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 5/56 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing a heat resistant resin film with a metal thin film is configured to include the steps of: biasing a conductive material to one surface of the heat resistant resin film; and applying electrolytic plating to the heat resistant resin film while using the conductive material biased to the one surface of the heat resistant resin film as an electrode, so as to form a metal thin film on the heat resistant resin film.


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