The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2008

Filed:

Dec. 04, 2006
Applicants:

Thirumani A. Selvan, Bangalore, IN;

Saravanan Sadasivan, Bangalore, IN;

Inventors:

Thirumani A. Selvan, Bangalore, IN;

Saravanan Sadasivan, Bangalore, IN;

Assignee:

Honeywell International Inc., Morristown, NJ (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A MEMS based pressure sensor for flow measurements includes a pressure sense die located between a media seal and a conductive seal. Such a system includes a pressure sense die located between a media seal and a conductive seal. A sensing diaphragm is generally associated with the pressure sense die, wherein the sensing diaphragm deflects when a pressure is applied thereto. An impedance circuit is generally embedded with one or more resistors on the sensing diaphragm to which the pressure to be detected is applied. An ASIC is generally associated with the impedance circuit and the sense die, wherein the ASIC is placed on a lead frame for signal conditioning in order to detect a change in the pressure.


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