The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2008
Filed:
Jun. 30, 2005
Qiwei LU, Schenectady, NY (US);
Michael O'brien, Clifton Park, NY (US);
Gerardo Rocha-galicia, Clifton Park, NY (US);
Prameela Susarla, Clifton Park, NY (US);
Qiwei Lu, Schenectady, NY (US);
Michael O'Brien, Clifton Park, NY (US);
Gerardo Rocha-Galicia, Clifton Park, NY (US);
Prameela Susarla, Clifton Park, NY (US);
Abstract
A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica filler, based on the total weight of the composition. After curing, the composition exhibits improved increased copper adhesion and reduced shrinkage compared to conventional molding compositions.