The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2008

Filed:

Nov. 26, 2003
Applicants:

Kerry Leeds Davison, Allentown, PA (US);

Donald Earl Hawk, Jr., King of Prussia, PA (US);

Yehuda Smooha, Allentown, PA (US);

Inventors:

Kerry Leeds Davison, Allentown, PA (US);

Donald Earl Hawk, Jr., King of Prussia, PA (US);

Yehuda Smooha, Allentown, PA (US);

Assignee:

Agere Systems Inc., Allentown, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/46 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit device comprising a die having a top surface with a peripheral region and an interior region surrounded by the peripheral region. Bond pads are disposed in the peripheral region of the die. One or more internal buses are disposed in the interior region of the die. The one or more internal buses distribute power to internal node points of the die. One or more bond wires connect one or more peripheral bond pads with one or more internal buses.


Find Patent Forward Citations

Davison, Kerry. (2008). Methods and apparatus for integrated circuit device power distribution via internal wire bonds (U.S. Patent No. 7429703). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7429703

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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