The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2008

Filed:

Mar. 16, 2006
Applicant:

Tomoyuki Nakao, Kawasaki, JP;

Inventor:

Tomoyuki Nakao, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A first power supply layer spreads over an insulating layer outside an island of a second power supply layer. A first ground layer spreads over an insulating layer outside an island of a second ground layer. First and second electrically-conductive pieces are interposed between the first and second power supply layers as well as between the first and second ground layers. A capacitor is interposed between the first and second electrically-conductive pieces. Power supply noise is forced to inevitably pass through the electrically-conductive pieces. The power supply noise thus reliably flows into the capacitor through the first and second electrically-conductive pieces. A printed wiring board is in this manner allowed to enjoy a sufficient suppression of the power supply noise.


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Nakao, Tomoyuki. (2008). Printed wiring board including power supply layer and ground layer (U.S. Patent No. 7428155). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7428155

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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