The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2008
Filed:
Feb. 17, 2006
Ming-hang Hwang, Taipei, TW;
Yu-chiang Cheng, Taipei, TW;
Chao-yi Chen, Taipei, TW;
Ping-feng Lee, Banciao, TW;
Hsin-lung Kuo, Taipei, TW;
Bin-wei Lee, Taipei, TW;
Wei-chung Hsiao, Taipei, TW;
Ming-Hang Hwang, Taipei, TW;
Yu-Chiang Cheng, Taipei, TW;
Chao-Yi Chen, Taipei, TW;
Ping-Feng Lee, Banciao, TW;
Hsin-Lung Kuo, Taipei, TW;
Bin-Wei Lee, Taipei, TW;
Wei-Chung Hsiao, Taipei, TW;
Mitac Technology Corp., Hsin-Chu Hsien, TW;
Abstract
This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste heat generated from the chip. The cover can be made of a special thermal conduction material, including a metal and a bracket structure of carbon element which have high thermal conductivity so as to improve the efficiency of heat conduction. The corresponding manufacturing method for this heat conduction material can be made with chemical vapor deposition, physical vapor deposition, electroplating or the other materials preparation method. The bracket structure of carbon element can be coated on the metal surface and also can be mixed into the metal.