The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2008
Filed:
Jun. 11, 2007
Masafumi Muramatsu, Tokyo, JP;
Masafumi Muramatsu, Tokyo, JP;
Sony Corporation, , JP;
Abstract
A method of manufacturing a solid-state image pickup device comprises a process for forming a plurality of photoelectric conversion elements PD within a semiconductor substrate, a process for forming an interconnection portion, having an interconnection layerin an insulating layer, on the surface side of the semiconductor substrate, a process for forming an adhesive layer, made of a material cured at a temperature lower than a deterioration starting temperature of the interconnection layer, on the surface of the interconnection portion and bonding a supporting substrateto the surface side of the interconnection portion through the adhesive layerby heat treatment at a temperature lower than the deterioration starting temperature of the interconnection layerand a process for decreasing a thickness of the semiconductor substratefrom the back side. A solid-state image pickup device manufacturing method can bond the supporting substrateto the surface side of the interconnection portion through the adhesive layerwithout exerting a thermal influence upon the interconnection layerthat was previously formed on the surface side of the semiconductor substrate
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile