The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2008
Filed:
May. 18, 2005
Shinji Morimoto, Onojyo, JP;
Koji Nakashima, Onga-gun, JP;
Toyokazu Yoshino, Fukuoka, JP;
Katsuya Okamoto, Kasuga, JP;
Shinji Morimoto, Onojyo, JP;
Koji Nakashima, Onga-gun, JP;
Toyokazu Yoshino, Fukuoka, JP;
Katsuya Okamoto, Kasuga, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A flexible printed wiring board has a configuration which is equipped with a solder resist portion formed by coating through the use of a screen printing method on a region including a component mounting portion of a conductor pattern, and a cover lay film pasted in such a manner that an outer circumference portion of an opening portion overlaps an upper portion of a circumference portion of the solder resist portion. A manufacturing method of a flexible printed wiring board of the invention has a configuration which is equipped with a conductor pattern forming process, a solder resist forming process, and a cover lay film pasting process.