The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2008
Filed:
Jul. 01, 2003
Hiroaki Kurihara, Shimonoseki, JP;
Hiroaki Kurihara, Shimonoseki, JP;
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Abstract
The present invention provides a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. The invention also provides a method for producing the flexible wiring substrate. The flexible wiring substrateincludes an insulating substrate, a wiring patternformed on a surface of the insulating substrate, and a solder resist layercovering a surface of the wiring patternexcluding at least terminal portions of the wiring pattern, at least a portion of the outermost surface of the wiring patternwhich is not covered with the solder resist layerbeing provided with a tin-bismuth alloy plating layer, characterized in that the wiring patterncomprises a base layerformed of a conductor and that a first tin plating layeris provided on the base layerso as to extend under a region covered with the solder resist layerand also under a region not covered with the solder resist layer