The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2008
Filed:
Jul. 14, 2006
Felix C. LI, San Jose, CA (US);
Felix C. Li, San Jose, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
An apparatus and method for an enhanced thermally conductive package for high powered semiconductor devices. The package includes a semiconductor die having an active surface and a non-active surface and a metal layer formed on the non-active surface of the die. The package is intended to be mounted onto a metal pad provided on a printed circuit board. A solder is used to affix the metal layer on the non-active surface of the die to the metal pad of the printed circuit board. The interface between the die and the printed circuit board thus includes just three metal layers, including the non-active surface of the die, the solder, and the metal pad on the printed circuit board. The reduced number of metal layers improves heat dissipation and thermal conductivity of the package.