The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2008

Filed:

May. 12, 2003
Applicants:

Wilhelmus Gerardus Jozef Gal, Kilder, NL;

Franciscus Bernardus Antonius DE Vries, Eibergen, NL;

Assignee:

Fico B.V., , NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 21/44 (2006.01); H01L 23/495 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a method for encapsulating an electronic component, in particular a semiconductor, fixed on a carrier, comprising the processing steps of: a) placing at least one foil layer in a mould, b) placing the carrier in contact with the foil layer with the side remote from the component, and c) encapsulating the electronic component with encapsulating material, wherein the foil layer undergoes a treatment whereby the adhesion of the foil layer is increased such that it adheres to the carrier. The invention also relates to a foil material for applying during such a method.


Find Patent Forward Citations

Loading…