The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2008
Filed:
Nov. 18, 2005
Jason P Paradis, Orange, CT (US);
Peter T Collings, Shelton, CT (US);
Chipping Sye, Stamford, CT (US);
Jihad Abdul-rahiim, Brooklyn, NY (US);
Jason P Paradis, Orange, CT (US);
Peter T Collings, Shelton, CT (US);
Chipping Sye, Stamford, CT (US);
Jihad Abdul-Rahiim, Brooklyn, NY (US);
Pitney Bowes Inc., Stamford, CT (US);
Abstract
A moistening device that significantly reduces any loss of contact between the applicator and envelope flap regardless of the thickness of the mail piece or size of the flap, thereby ensuring sufficient wetting of the glue line on the envelope flap with moistening fluid, is provided. A deflection device is added to a portion of the support to which the applicator is secured. The deflection device is located and sized to exert a force on the applicator, causing the applicator to form into a shape that more closely matches the shape of an envelope flap being processed, while also allowing the applicator to flex slightly in multiple directions. This results in little to no loss of contact between the applicator and glue line on the envelope flap, thereby allowing sufficient moistening fluid to be transferred from the applicator to the glue line.