The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2008
Filed:
Apr. 27, 2006
Shosaku Ishihara, Chigasaki, JP;
Osamu Ikeda, Yokohama, JP;
Ryouichi Kajiwara, Hitachi, JP;
Shinji Hiramitsu, Kashiwa, JP;
Satoshi Matsuyoshi, Takahagi, JP;
Shosaku Ishihara, Chigasaki, JP;
Osamu Ikeda, Yokohama, JP;
Ryouichi Kajiwara, Hitachi, JP;
Shinji Hiramitsu, Kashiwa, JP;
Satoshi Matsuyoshi, Takahagi, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The present invention provides a semiconductor device comprising a semiconductor element and a copper member which are bonded to each other by a bismuth-based (Bi-based) bonding material having its melting temperature of not less than 250° C., wherein silver (Ag) is diffused in a region of the bonding material in the vicinity of an interface thereof to the semiconductor element with an inclination of concentration of the silver from the interface, in order to realize a manufacture of the semiconductor device without using lead (Pb) at low cost.