The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2008
Filed:
Dec. 15, 2005
Yasunari Hino, Tokyo, JP;
Hiroyuki Akita, Tokyo, JP;
Masaki Kato, Tokyo, JP;
Yoshihito Asao, Tokyo, JP;
Yasunari Hino, Tokyo, JP;
Hiroyuki Akita, Tokyo, JP;
Masaki Kato, Tokyo, JP;
Yoshihito Asao, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A method for assembling semiconductor switching elements and a heat sink in a rotary electric machine includes: a first step in which bare chips of the semiconductor switching elements are bonded to the heat sink using a good heat conductive bonding material; a second step which connects the bare chips to a wiring part by wire bonding; and a third step in which a resin which seals the bare chips and the wiring part is applied to the heat sink in a striding manner in a state that output terminal portions of the wiring part and fins of the heat sink are exposed to the outside of the resin.