The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2008

Filed:

Jan. 11, 2002
Applicants:

Toshio Sugawa, Katano, JP;

Satoshi Murakawa, Neyagawa, JP;

Masaaki Hayama, Nara, JP;

Takeo Yasuho, Neyagawa, JP;

Inventors:

Toshio Sugawa, Katano, JP;

Satoshi Murakawa, Neyagawa, JP;

Masaaki Hayama, Nara, JP;

Takeo Yasuho, Neyagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01R 12/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.


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