The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7422958 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 09, 2008

Filed:

Jun. 21, 2007
Applicants:

Marek Kostrzewa, Grenoble, FR;

Fabrice Letertre, Meylan, FR;

Inventors:

Marek Kostrzewa, Grenoble, FR;

Fabrice Letertre, Meylan, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for fabricating a mixed substrate that include insulating material layer portions buried in a substrate of semiconductor material. The method includes providing a support substrate made of semiconductor material and having a front face that includes open cavities; providing a layer of an insulating material upon the front face of the support substrate and into the cavities; polishing the layer to provide a perfectly planar surface; bonding a source substrate to the planar surface of the support substrate; withdrawing a portion of the source substrate to provide an assembly having a thin useful or active layer upon the insulating layer of the support substrate; and heat treating the assembly in a selected atmosphere at a temperature and for a time sufficient to diffuse atoms from the insulating layer and through the thin layer to reduce the thickness of the insulating layer while retaining the insulating material in the cavities of the support substrate.


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