The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2008
Filed:
Apr. 12, 2006
Applicant:
Takeshi Saito, Matsumoto, JP;
Inventor:
Takeshi Saito, Matsumoto, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 29/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for manufacturing a semiconductor device, includes: forming a recognition mark that defines a well-forming region for forming a well on a semiconductor substrate; forming a mask, using the recognition mark, that is patterned so that the well-forming region is opened; introducing an impurity into the well-forming region; performing heat treatment for forming a well by diffusing the impurity; and forming an element isolation region on the semiconductor substrate.
Quick Actions:
Saito, Takeshi. (2008). Method for manufacturing a semiconductor device, as well as a semiconductor substrate (U.S. Patent No. 7422955). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7422955
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile