The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2008
Filed:
Mar. 02, 2005
Kendra J. Gallup, Marina del Rey, CA (US);
Frank S. Geefay, Cupertino, CA (US);
Ronald Shane Fazzio, Loveland, CO (US);
Martha Johnson, Graeley, CO (US);
Carrie Ann Guthrie, Fort Collins, CO (US);
Tanya Jegeris Snyder, Edna, MN (US);
Richard C. Ruby, Menlo Park, CA (US);
Kendra J. Gallup, Marina del Rey, CA (US);
Frank S. Geefay, Cupertino, CA (US);
Ronald Shane Fazzio, Loveland, CO (US);
Martha Johnson, Graeley, CO (US);
Carrie Ann Guthrie, Fort Collins, CO (US);
Tanya Jegeris Snyder, Edna, MN (US);
Richard C. Ruby, Menlo Park, CA (US);
Avago Technologies Fiber IP Pte Ltd, Singapore, SG;
Abstract
In an embodiment, the invention provides a method for forming a wafer-level package. A bonding pad is formed on a first wafer. After forming the bonding pad, an optoelectronic device is located on the first wafer. A gasket is formed on a second wafer. After a gasket is formed on a second wafer, the second wafer is attached to the first wafer with a bond between the gasket and the bonding pad.