The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2008
Filed:
Feb. 14, 2006
Toshi Saeki, Okazaki, JP;
Makoto Suzuki, Okazaki, JP;
Katsumasa Isogai, Okazaki, JP;
Kazuhiro Hanai, Okazaki, JP;
Syuuichi Hazama, Okazaki, JP;
Toshi Saeki, Okazaki, JP;
Makoto Suzuki, Okazaki, JP;
Katsumasa Isogai, Okazaki, JP;
Kazuhiro Hanai, Okazaki, JP;
Syuuichi Hazama, Okazaki, JP;
Daiwa Kasei Indsutry Co., Ltd., Aichi, JP;
Abstract
The present invention provides an injection molding method which intends to lower a mold clamping force in view of both of a projected area of a molded article and an injection pressure, and contributes to an energy saving and a reduction in a cost of equipment and a manufacturing cost. In a cavity () formed in a metal mold () for an injection molding, there are arranged a first gate () injecting a first molten resin () anteceding in one end side (a charging start side) in a longitudinal direction, and a second gate () injecting a second molten resin () following in another end side (a charging finish side). The second molten resin () is newly injected from the second gate () before a fluid head portion of the first molten resin () injected from the first gate () reaches a position of the second gate (). Further, the first molten resin () becomes in an approximately cooled and solidified state by the time when the second molten resin () reaches a terminal end in the charging finish side within the cavity ().