The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2008

Filed:

Feb. 13, 2004
Applicants:

Osamu Nakao, Sakura, JP;

Reiji Higuchi, Sakura, JP;

Syouji Ito, Sakura, JP;

Masahiro Okamoto, Sakura, JP;

Inventors:

Osamu Nakao, Sakura, JP;

Reiji Higuchi, Sakura, JP;

Syouji Ito, Sakura, JP;

Masahiro Okamoto, Sakura, JP;

Assignee:

Fujikura Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A base material () is arranged on top of at least one first internal layer base material (), and a second internal base material () is arranged underneath the base material (). And thereafter a surface layer circuitry conductive foil () is arranged underneath the base material (), and subsequently these materials are colaminated for forming a colaminated body (). While this colaminating operation, conductive portions being formed in the base materialsare aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion () being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material () and the conductive foil () accordingly.


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